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Semiconductor Testers - MOSFET, IGBT, TRANSISTOR, DIODE, SCR, ZENER, BRIDGES

Lorlin Test Systems - Small Signal and Power Semiconductor Testers

Breakdown Voltages, Leakage Currents, Saturation, On-State, Off-State, Gain, HFE, DC, AC and other Dynamic Test Parameters

Lorlin® testers operate with a Windows 7, 8 and 10® 64-BIT Operating System and a USB 2.0 test system interface.  Customers can test components in bulk or large quantities of unknown part numbers and sort them by the  highest valued or desired parts of the day by using our special sorting classifying and priority order part number software yielding the most profitable results for distributors and manufacturers.

Lorlin Test Systems® manufactures and distributes semiconductor component test systems. Through years of dedicated engineering excellence, proven designs, and achievements, Lorlin is proud to maintain the leading cutting edge technology offered in our products. Lorlin's dynamic and encompassing solutions are tailored to customers specific needs and requirements for virtually any test application.

Proven superior and advanced analog and digital electronics engineering designs for over 50 years utilizing advanced circuitry and technology is why Lorlin products are so desired by engineers.  Our visions of the research and development needed to meet the demands of today were realized years ago. 

Smooth, flawless and flowing engineering design excellence have yielded success, complete customer satisfaction and overwhelming confidence in Lorlins equipment performance. Our test concepts have been developed in an environment of creative flux and intuition with achievements unsurpassed.

Our flexibility and creativity enable us to fulfill your application desires and targeted test and manufacturing goals while staying within your budget. The parametric testing equipment is used to test, evaluate and analyze the electrical characteristics of semiconductor devices in component testing and semiconductor manufacturing applications such as production and final test, wafer probe and wafer mapping, QC & QA test, incoming inspection, engineering evaluation and characterization, high reliability, and high volume testing. 

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